3D Stacked Package Technology and Its Application Prospects

@article{Zheng20093DSP,
  title={3D Stacked Package Technology and Its Application Prospects},
  author={Jianyong Zheng and Zhisheng Zhang and Yigao Chen and Jinfei Shi},
  journal={2009 International Conference on New Trends in Information and Service Science},
  year={2009},
  pages={528-533}
}
In recent years, the increasing demands for the high performance integrated circuit devices have led to the development of multi-die stacked technology in a single package form. The 3D (three dimension) stacked package technology is developing trend of the integrated circuit advanced high-density packaging, which can easily meet the developing of smaller footprint, lower profile, multi-function, lower power consumption and lower cost for the cell phones and consumer products like digital… CONTINUE READING
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