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@article{Liu20073DMO, title={3D Modeling of Electromigration Combined with Thermal-Mechanical Effect for IC Device and Package}, author={Yong Liu and Lihua Liang and Scott Irving and Timwah Luk}, journal={2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007}, year={2007}, pages={1-13} }

- Published 2007 in 2007 International Conference on Thermal…
DOI:10.1016/j.microrel.2008.03.021

This paper studies the numerical simulation method for electromigration in IC device and solder joint in a package under the combination of high current density, thermal load and mechanical load. The three dimensional electromigration finite element model for IC device/interconnects and solder joint reliability are developed and tested. Numerical experiment is carried out to obtain the electrical, thermal and stress fields with the migration failure under high current density loads. The direct… CONTINUE READING

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