3D Integration technology: Status and application development

@article{Ramm20103DIT,
  title={3D Integration technology: Status and application development},
  author={Peter Ramm and Armin Klumpp and Josef Weber and Nicolas Lietaer and Maaike M. Visser Taklo and Walter De Raedt and Thomas Fritzsch and Pascal Couderc},
  journal={2010 Proceedings of ESSCIRC},
  year={2010},
  pages={9-16}
}
As predicted by the ITRS roadmap, semiconductor industry development dominated by shrinking transistor gate dimensions alone will not be able to overcome the performance and cost problems of future IC fabrication. Today 3D integration based on through silicon vias (TSV) is a well-accepted approach to overcome the performance bottleneck and simultaneously shrink the form factor. Several full 3D process flows have been demonstrated, however there are still no microelectronic products based on 3D… 
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