3D Integration technology: Status and application development

  title={3D Integration technology: Status and application development},
  author={P. Ramm and A. Klumpp and J. Weber and N. Lietaer and Maaike Taklo and W. D. Raedt and T. Fritzsch and P. Couderc},
  journal={2010 Proceedings of ESSCIRC},
  • P. Ramm, A. Klumpp, +5 authors P. Couderc
  • Published 2010
  • Engineering, Computer Science
  • 2010 Proceedings of ESSCIRC
  • As predicted by the ITRS roadmap, semiconductor industry development dominated by shrinking transistor gate dimensions alone will not be able to overcome the performance and cost problems of future IC fabrication. Today 3D integration based on through silicon vias (TSV) is a well-accepted approach to overcome the performance bottleneck and simultaneously shrink the form factor. Several full 3D process flows have been demonstrated, however there are still no microelectronic products based on 3D… CONTINUE READING
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