3D Integration challenges today from technological toolbox to industrial prototypes

@article{Mourier20133DIC,
  title={3D Integration challenges today from technological toolbox to industrial prototypes},
  author={Thierry Mourier and Catherine Ribi{\`e}re and Gonzalo Romero and Marisa Gottardi and N. Allouti and Rapha{\"e}l Eleouet and Armando Roman and Thomas Magis and St{\'e}phane Minoret and Christophe Ratin and Daniel Scevola and Etienne Dupuy and Brunella Martin and Laurence Gabette and Denis Marseilhan and Thierry Enot and M. Adolphe Pellat and Virginie Loup and R. Segaud and H{\'e}l{\`e}ne Feldis and Albert Charpentier and Joakim Bally and Myriam Assous and I. Charbonnier and C. Laviron and Perceval Coudrain and Nicolas Sillon},
  journal={2013 IEEE International Interconnect Technology Conference - IITC},
  year={2013},
  pages={1-3}
}
3D integration, also referred as “More than Moore” approach is considered as the most attractive alternative to “More Moore” concept in order to increase circuit functionalities and performances while keeping reasonable cost of integrated devices. This technology has been widely presented and discussed during last years and is now available on several world wide integration platforms. Major part of the work done in recent years was focused on the three challenges to be overcome to allow… CONTINUE READING

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