3D ICs in the real world

  title={3D ICs in the real world},
  author={D. James},
  journal={25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014)},
  • D. James
  • Published 19 May 2014
  • Engineering
  • 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014)
There has been much discussion (hype, even!) of 3D chip stacking taking over when the device shrinkage described by Moore's Law comes to an end. To hear some industry commentators, through-silicon vias (TSVs) will enable a revolution in performance and enable the next several generations of electronics evolution. In fact the transition to commercial 3D stacking of heterogeneous components is taking much longer than was predicted a few years ago. While commodity parts such as flash memory or… 
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