3D FPGA using high-density interconnect Monolithic Integration

New 3D technology, called “Monolithic Integration”, offers very dense 3D interconnect capabilities. In this paper, we propose a 3D FPGA architecture with logic-on-memory approach based on this technology. The routing and computation blocks are splitted into two layers where the logic is placed on the top and memory on the bottom. Using extracted values from… CONTINUE READING

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Citations per Year

Citation Velocity: 7

Averaging 7 citations per year over the last 3 years.

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