3D Defect Localization on Exothermic Faults within Multi-Layered Structures Using Lock-In Thermography: An Experimental and Numerical Approach

@inproceedings{Bae20173DDL,
  title={3D Defect Localization on Exothermic Faults within Multi-Layered Structures Using Lock-In Thermography: An Experimental and Numerical Approach},
  author={Ji-Yong Bae and Kye-Sung Lee and Hwan Hur and Ki-Hwan Nam and Sukju Jung and Ah-Yeong Lee and Ki Soo Chang and Geon-Hee Kim and Ghiseok Kim},
  booktitle={Sensors},
  year={2017}
}
Micro-electronic devices are increasingly incorporating miniature multi-layered integrated architectures. However, the localization of faults in three-dimensional structure remains challenging. This study involved the experimental and numerical estimation of the depth of a thermally active heating source buried in multi-layered silicon wafer architecture by using both phase information from an infrared microscopy and finite element simulation. Infrared images were acquired and real-time… CONTINUE READING

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