3-Dimensional Circuitry Laser Direct Structuring Technology (LPKF-LDS) for Moulded Interconnect Devices

@inproceedings{20123DimensionalCL,
  title={3-Dimensional Circuitry Laser Direct Structuring Technology (LPKF-LDS) for Moulded Interconnect Devices},
  author={},
  year={2012}
}
  • Published 2012
For a state-of-the-art dental hand-piece the basic attachment board has been designed using LPKF-LDS technology. This enables compact, easy construction and a higher level of functionality. The device integrates control of heated water supply, air supply and special illumination. The 3-dimensional circuitry performed directly onto the plastic component… CONTINUE READING