2.5D/3D Packaging Drives New Lithography Requirements for Production Equipment

  • Published 2015

Abstract

As traditional semiconductor scaling becomes increasingly complex and cost-prohibitive, transitioning from planar chip packaging architectures to 2.5D/3D stacked die package architectures has become key to enable the integration of greater amounts of chip functionality in smaller form factors. This need for form factor reduction, together with smaller… (More)

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