2-Dimensional Wavelet pre-processing to extract IC-Pin information for disarrangement analysis

Abstract

Due to higher processing power to cost ratio, it is now possible to replace the manual detection methods used in the IC (Integrated Circuit) industry by Image-processing based automated methods, to detect a broken pin of an IC connected on a PCB during manufacturing, which will make the process faster, easier and cheaper. In this paper an accurate and fast automatic detection method is used where the top view camera shots of PCBs are processed using advanced methods of 2-dimensional discrete wavelet pre-processing before applying edge-detection. Comparison with conventional edge detection methods such as Sobel, Prewitt and Canny edge detection without 2-D DWT is also performed.

Cite this paper

@inproceedings{Kumar20132DimensionalWP, title={2-Dimensional Wavelet pre-processing to extract IC-Pin information for disarrangement analysis}, author={K. Pramod Kumar and Anamika Yadav and Himanshi Rani and Yashaswi Nijhawan and Sudha Radhika}, year={2013} }