(Appl. Phys. Lett., 93(11):111907)Improved thermal management of GaN/sapphire light-emitting diodes embedded in reflective heat spreaders

@inproceedings{Horng2008ApplPL,
  title={(Appl. Phys. Lett., 93(11):111907)Improved thermal management of GaN/sapphire light-emitting diodes embedded in reflective heat spreaders},
  author={Ray-Hua Horng and Chia Chin Chiang and Hsin Ying Hsiao and Xinhe Zheng and Dong Sing Wuu and Hsueh I Lin},
  year={2008}
}
Using maskless lithography and electroforming techniques, we have demonstrated an enhanced performance of GaN/sapphire light-emitting diode (LED) embedded in a reflective copper heat spreader. The chip size and dominant wavelength of the blue emitter used in this research is 1×1 mm2 and 455 nm, respectively. The cup-shaped LED heat sink is electroformed on sapphire directly using the spin-coated photoresist coated with the Au/Cr/Ag mirror as a mold and dicing into the embedded LED with a Cu… CONTINUE READING

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