‘Collet Auto Clean System’, A Smart Automatic Solution for Die Bonding Pick Up Tool Lifespan & Throughput Enhancement

@article{Liau2018ColletAC,
  title={‘Collet Auto Clean System’, A Smart Automatic Solution for Die Bonding Pick Up Tool Lifespan & Throughput Enhancement},
  author={Wai Shan Liau and Tek Keong Gan},
  journal={2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)},
  year={2018},
  pages={1-6}
}
The common problem vespel collet; the eutectic die bonding process pick up tool; is a short lifespan. The collet tip dimension is similar to shrink chip (size<0.05mm2), which causes an aggressive rubbing effect during die pick and bond cycle. Debris is generated and then accumulated the surrounding of the collet tip surface gradually. Clogged vespel collet tip will result in die pickup issue and accummulated debris will also damage the protruded guard ring design on the chip surface. As such… CONTINUE READING

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