${\rm M}^{3}$-Deterministic, Multiscale, Multirobot Platform for Microsystems Packaging: Design and Quasi-Static Precision Evaluation

@article{Popa2009rmMM,
  title={\$\{\rm M\}^\{3\}\$-Deterministic, Multiscale, Multirobot Platform for Microsystems Packaging: Design and Quasi-Static Precision Evaluation},
  author={Dan O. Popa and Rakesh Murthy and Aditya N. Das},
  journal={IEEE Transactions on Automation Science and Engineering},
  year={2009},
  volume={6},
  pages={345-361}
}
The dawn of next generation robots and systems era which is quietly emerging, requires miniaturized and integrated sensors, actuators, and entire microrobots. One of the defining characteristics of these microsystems is their multiscale nature, e.g., the span of their size, features, and tolerances across multiple dimensional scales, from the meso to the micro and nanoscales. Another defining characteristic is the need to reliably integrate heterogeneous materials via assembly and packaging, in… CONTINUE READING

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