"Non-piercing" — A must for flip chips!

  title={"Non-piercing" — A must for flip chips!},
  author={Ingolf Schlosser},
  journal={2015 European Microelectronics Packaging Conference (EMPC)},
Compared to the COB process (wire bonding) the flip-chip process is significantly more intolerant to pre-existing mechanical die damage. This can be caused by the mechanical pretreatment of the dies, the thinning and sawing of the wafers, but above all by the cutting out of the dies during the assembly process. The pre-existing damage constitutes a reliability risk, as thermal shock testing demonstrates. The international standards MIL-STD 883G, JESD22-B118, ESCC 2049000 currently give too… CONTINUE READING