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Thermal issues are a primary concern in the three-dimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized during 3D floorplanning, significantly increasing optimization complexity. Most existing floorplanners use combinatorial stochastic optimization techniques, hampering performance and(More)
A complete placement system, UPlace, for mixed mode designs is presented, which consists of a force-directed global placement, and a zone-refinement based detailed placement. For global placement, a unified objective function capturing both wire length and cell distribution is proposed; quadratic programming is formulated to optimize the unified object(More)
Congestion minimization is the least understood in placement objectives, however, it models routability most accurately. In this paper, a new incremental placement algorithm C-ECOP for standard cell layout is presented to reduce routing congestion. Congestion estimation is based on a new routing model and a more accurate cost function. An integer linear(More)
Incorporating thermal vias into 3D ICs is a promising way to reduce circuit temperature by lowering down the thermal resistances between device layers. In this paper, we integrate dynamic thermal via planning into 3D floorplanning process. Our 3D floorplanning and thermal via planning approaches are implemented in a two-stage approach. Before floorplanning,(More)
In this paper, we investigate thermal via (T-via) planning during three-dimensional (3-D) floorplanning. First, we consider the temperature constrained T-via planning (TVP) problem on a given 3-D floorplan. Second, we integrate dynamic TVP into 3-D floorplanning process. Our main contribution and results can be summarized as follows. We solve the(More)
Detailed routing is an important stage in VLSI physical design. Due to the high routing complexity, it is difficult for existing routing methods to guarantee total completion without design rule checking violations (DRCs) and it generally takes several days for designers to fix remaining DRCs. Studies has shown that the low routing quality partly results(More)
An efficient and effective divide-andconquer 2.5-D floorplanning algorithm is proposed for wirelength optimization. Modules are pre-partitioned into different dies with respect to the statistical wirelength estimation result. Then floorplan is generated on each die for wirelength optimization. The new partitioning method successfully solves the confliction(More)
New three-dimensional (3D) floorplanning and thermal via planning algorithms are proposed for thermal optimization in two-stacked die integration. Our contributions include (1) a two-stage design flow for 3D floorplanning, which scales down the enlarged solution space due to multidevice layer structure; (2) an efficient thermal-driven 3D floorplanning(More)
For modern processor designs in nanometer technologies, both block and interconnect pipelining are needed to achieve multi-gigahertz clock frequency, but previous approaches consider block pipelining and interconnect pipelining separately. For example, all recent works on wire pipelining assume pre-pipelined components and consider only inserting pipeline(More)