Zhou Liangjie

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Solder bump joint has been accepted as a main FCOB interconnection method so far. To optimize the process conditions for achieving SAC305 solder bumped FCOB assembly with maximum die shear strength and allowable void rate, an orthogonal experimental design of four factors and three levels was carried out. The optimal process conditions are: 100 seconds for(More)
Anisotropic conductive adhesive (ACA) offers a promising solution for fine-pitch interconnections, which is low cost, low temperature and environmentally clean. Good mechanical property and high reliability are both required for ACAs to be an alternative of solders. In this study, three types of ACAs and one lead-free solder were selected to investigate(More)
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