Zhifeng Dou

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Epoxy molded package and silicone gel module are compared in short-circuit failure mode with respect to critical energy, I<sup>2</sup>T<inf>melting</inf> and explosion energy capabilities. The molded technology yields a very low and stable R<inf>sc</inf> &#x0022;residual ohmic value&#x0022; of the dies in low energy short failure which are analyzed through(More)
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