Zhi Chao Huang

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In this paper a highly integrated MCP concept apply to MMICs from DC up to Ku-band is presented. This type of package of low-temperature co-fired ceramic system-in-package (LTCC-SIP) with ball grid array (BGA) structures hereby can realize miniaturization, low-weight and multifunction. More than one of the multi-function MMICs are wire-bonding or flip-chip(More)