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Inertial measurement units (IMUs) are widely used in motion measurement. However, the drift of IMUs results in significant accumulated errors for long-term position and orientation measurement. This paper reports a method to compensate the drift of inertial sensors with the assist of ultrasonic sensors and magnetometers. The magnetometer is combined with a(More)
Low capacitance is critical to the electric performance of through-silicon-vias (TSVs). This paper reports the development of a low capacitance TSVs by replacing silicon dioxide insulation layers (liners) with benzocyclobutene (BCB) polymer. The BCB liner TSVs are fabricated by etching deep annular trenches on substrates, void-free filling the trenches with(More)
This letter reports for the first time the fabrication and characterization of through-silicon vias (TSVs) using air-gap insulators to enable high-performance 3-D integration. To address the challenge in fabricating extremely high-aspect-ratio air gaps, a CMOS-compatible sacrificial technology based on pyrolysis of poly (propylene carbonate) has been(More)
Replacing silicon dioxide with polymers that have low dielectric constants as the insulation (liner) materials is of great help in reducing the capacitive coupling of throughsilicon-vias and improving the reliability. This paper presents the fabrication of uniform poly propylene carbonate (PPC) polymer liners in high aspect ratio trenches by addressing the(More)
We report the detection of p53 antibody as a biomarker for early-stage cancer diagnosis using a microcantilever biosensor with piezoresistive readout. The accumulation of p53 antibody in human sera is found strongly involved in a variety of human cancers, thus simple and fast detection of the level of p53 antibody is of importance in clinical application.(More)
This paper presents the design, fabrication, and characterization of a piezoelectric micromachined ultrasonic transducer (pMUT) operating in d<sub>33</sub> mode. A piezoelectric PZT thin film is polarized along the in-plane direction using top square interdigital electrodes (IDEs), and the in-plane polarization and IDEs enable the pMUT to operate in(More)
Cell-substrate interaction is one of the most important aspects of tissue engineering. Changes of MSCs interfacial behaviors were found to be triggered by 10 μm wide grooved pattern on poly(3-hydroxybutyrate-co-3-hydroxyhexanoate) (PHBHHx). Global marker genes expression and miRNAs profiling analysis provided insights into the regulation network of the(More)
This paper presents a method for measuring the complex permittivity of Ba/sub 0.5/Sr/sub 0.5/TiO/sub 3/ (BST) ferroelectric thin films on a four-layered substrate at frequencies from 50 MHz to 26.5 GHz. Coplanar waveguide (CPW) lines are employed to measure the permittivity at high frequencies, whereas at low frequencies interdigital capacitors (IDCs) are(More)
Low capacitance is critical to the electric performance of through-silicon vias (TSVs). This paper reports the development and electrical characterization of ultralow-capacitance TSVs which use air gaps to replace the conventional silicon dioxide as the insulation layers. The air-gap TSVs are successfully fabricated by developing a sacrificial technology(More)