Zhenming Tang

Learn More
—The impact of phase change (from solid to liquid) on the reliability of Pb-free flip-chip solders during board-level interconnect reflow is investigated. Most of the current candidates for Pb-free solder are tin-based with similar melting temperatures near 230 C. Thus, Pb-free flip-chip solders melt again during the subsequent board-level interconnect(More)
  • 1