ZhenYu Wu

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In 2008 January the twenty-fourth Chinese expedition team successfully deployed the Chinese Small Telescope ARray (CSTAR) to Dome A, the highest point on the Antarctic plateau. CSTAR consists of four 14.5 cm optical telescopes, each with a different filter (g, r, i, and open) and has a 4:5° × 4:5° field of view (FOV). It operates robotically as part of the(More)
The characteristics of FDG uptake in the physiologic and malignant nasopharynx were investigated in the paper which was correlated with either pathologic findings or clinical follow-up. Three patients had pathologically established nasopharyngeal malignancy. In the 3 nasopharyngeal malignancies, 2 had diffusely and expansively increased FDG uptake, and one(More)
Influenza is active during the winter and spring in the city of Beijing, which has a typical temperate climate with four clear distinct seasons. The clinical and laboratory surveillance data for influenza have been used to construct critical indicators for influenza activities in the community, and previous studies have reported varying degrees of(More)
This paper presents a finite element analysis on the tensile stiffness of steel bolted connections, which are fabricated from thin-walled cold-formed steel strips and members. This type of bolted connection is usually used to assemble the diagonal bracing member in the light steel structure. Unlike the architectural steel structure, thin walled steel bolted(More)
UNLABELLED A widespread application of integrin αvβ3 imaging has been emerging in both pre-clinical and clinical studies. But few studies reported its value as compared with 18F-FDG PET, especially for differentiated thyroid cancer (DTC). In this study, we compared the tracer uptake of 18F-AIF-NOTA-PRGD2 and 18F-FDG in lymph node metastasis of DTC to(More)
Stress-induced voiding (SIV) is investigated in Cu-based, deep-submicron, dual damascene technology. Two failure modes are revealed by TEM failure analysis. For one mode, voids are formed under the via when the via connects a wide metal lead below it. For the via which is instead under a wide metal line, voids are formed right above the via bottom. The void(More)
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