Zeng-Fu Zeng

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Die-to-die interconnects linking multiple functional dies in a modern 3-D or 2.5-D IC by micro-bumps could experience resistance increase after certain time of field operation due to parametric defects or aging. To cope with this reliability threat, we present an “on-line transition-time binning method” that aims to continuously detect(More)
A faulty interposer in a 2.5-D integrated circuit often results in a hefty loss as the potentially expensive known-good-dies bonded on the interposer will have to be discarded as well. To avoid such a last-minute loss during a multichip integration process, built-in self-repair (BISR) is highly valuable. Even though there have been many BISR schemes in the(More)
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