Zachery A. Jacobson

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Controlled and uniform assembly of "bottom-up" nanowire (NW) materials with high scalability presents one of the significant bottleneck challenges facing the integration of nanowires for electronic applications. Here, we demonstrate wafer-scale assembly of highly ordered, dense, and regular arrays of NWs with high uniformity and reproducibility through a(More)
  • Robert Hockman, Scott Fox, +13 authors Erik Erazo
  • 2005
The minutes of the February 8, 2005 meeting were presented for review. A motion was made and seconded to approve the minutes as presented. The motion carried without objection. A. Guest Parking Permits: TAPS staff recently discovered that 8 of 11 guest parking permits at Diamond Village were being used by students or staff. TAPS met with representatives(More)
The formation of crystalline NixInAs and NixInAs/InAs/NixInAs heterostructure nanowires by the solid source reaction of InAs nanowires with Ni is reported for the first time. The fundamental kinetics of the Ni/InAs alloying reaction is explored, with the Ni diffusion reported as the rate determining step. The diffusivity of Ni is independent of the nanowire(More)
One of the major challenges towards scaling electronic devices to the nanometre-size regime is attaining controlled doping of semiconductor materials with atomic accuracy, as at such small scales, the various existing technologies suffer from a number of setbacks. Here, we present a novel strategy for controlled, nanoscale doping of semiconductor materials(More)
We report large-scale integration of nanowires for heterogeneous, multifunctional circuitry that utilizes both the sensory and electronic functionalities of single crystalline nanomaterials. Highly ordered and parallel arrays of optically active CdSe nanowires and high-mobility Ge/Si nanowires are deterministically positioned on substrates, and configured(More)
A differential roll printing strategy is developed to enable large-scale and uniform assembly of highly aligned and ordered nanowire arrays on various rigid and flexible substrate materials. The dynamics of the process are explored by tuning the linear sliding motion of the roller with respect to the rolling motion, clearly demonstrating the importance of(More)
Capacitive transducer strengthening via ALD-enabled partial-gap filling, " Tech. ABSTRACT The electromechanical coupling factors (η e 's) of ca-pacitively-transduced micromechanical resonators have been increased by a factor of 8.1× via a process technology that utilizes atomic layer deposition (ALD) to partially fill the electrode-to-resonator gaps of(More)
A generic approach for deploying various types of synthetic nanomaterials, including single-walled carbon nanotubes and nanoparticles, at well-defined locations on substrates is presented. The assembly is achieved through the complementary design of the stationary and carrier phases and utilizes the dewetting process during which polymer-encapsulated(More)
Band-to-Band Tunneling Transistors: Scalability and Circuit Performance Continuing scaling of transistors as density approaches the terascale regime (10 12 devices/cm 2) requires evaluating new devices that can perform on several metrics beyond density scaling, such as cost savings, performance improvements, and energy efficiency. A comprehensive review and(More)
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