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Journals and Conferences
A new microwave integration technology of electroplating is proposed, which combines formation and mounting of multilayer structures. It uses a minimal amount of flanges in the waveguide communication lines for extrahigh frequency (EHF), and is capable also to integrate the metallic and non-metallic parts into the waveguide structure with no detachable… (More)
Possibilities of dramatic improvement in functionality by effects of bulk N-type Negative Differential Conductivity (N-NDC) in long inhomogeneous samples are described together with outstanding parameters of devices utilizing the effect.