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The measurement of the junction temperature with thermosensitive electrical parameters (TSEPs) is largely used by electrical engineers or researchers, but the obtained temperature value is generally not verified by any referential information of the actual chip temperature distribution. In this paper, we propose to use infrared (IR) measurements in order to(More)
Pulsating heat pipes (PHPs) have already found some applications in cooling power / micro electronic components. It was investigated whether a flat plate closed loop pulsating heat pipe can be applied for power electronics cooling. The measured thermal resistances were strongly influenced by the tilt angle, fill rate and working fluid. The best PHP(More)
In power electronic liquid cooling systems, the hydraulic circuit is generally implemented by a mechanical pump, which is big, noisy, expensive, and has a high power consumption. To solve these problems, it is proposed to replace the mechanical pump by an electrokinetic one, such as an electroosmotic (EO) pump. In this paper, we present the theory of(More)
Currently the thermal losses of power electronic devices like IGBTs are increasing. At the same time, their sizes are decreasing. Consequently heat sinks have to dissipate very large heat flux densities. Therefore the thermal environment is a main issue in their performance and reliability. In order to improve heat transfers, materials with high thermal(More)
Conventional methods of cooling are not an ideal way to overcome the heat problem in power electronics today. A simple solution would be using micro heat spreader as an integrated part in the silicon substrate. This investigation presents a detailed analysis on maximum heat transfer capabilities of silicon-water cooling devices, flat plate micro heat(More)
The temperature of power semiconductor devices is one of the main issues affecting the performance, availability, and reliability of power converters. The chip temperature is generally measured using thermosensitive electrical parameters (TSEPs). These parameters are well controlled for laboratory temperature measurements, where the power devices are not(More)
This study deals with the power electronics packaging and the needs for additional knowledge about electrical pressed contact behavior. For this, a measure bench has been realized. It is able to characterize the pressed interface between a metal electrode and a power chip as a function of the clamping force (08000N) and the temperature (up to 100°C). First(More)
Thermal management became a limiting factor in the development of high-power electronic devices, and new methods of cooling are required. Therefore, the use of liquid gallium alloys, whose thermal conductivity (approximately 28 W/m/K) is 40 times greater than thermal conductivity of water, is introduced. In the first part of this paper, we present a(More)
This paper focuses on a new generation of power modules, trying to optimize the tradeoff between thermal and electromagnetic interference (EMI) managements. At the same time, the packaging technique is considered in order to simplify the implementation of the power dies while improving the reliability of the structure. The approach considers the hybrid(More)
The goal of this research work is to develop and validate the design of a double-sided electronic substrate, part of a multilayer three-dimensional (3D) package, with an integrated heat exchanger (thin flat heat pipe) in order to evacuate the required total power losses of about 35 W. The paper describes the fabrication processes of a flat heat pipe and the(More)