• Citations Per Year
Learn More
Glass (7740) and silicon (100) wafer are bonded using gold as the bonding medium and annealed to enhance the bonding strength at temperature about 450°C. The voids in the bonding interface are the main reason to cause the poor reliability of bonding, and scanning electron microscope (SEM) photos reveal that there are a number of voids in the craters(More)
This paper reports the reactive i on etching (RIE) characteristics of partially-cured benzocyclobutene (BCB) in sulrur-hexafluoride/oxygen (S F<inf>6</inf>/O<inf>2</inf>) plasmas. The etching rate and etch anisotropy are mainly dependent on RF power, chamber pressure, and SF<inf>6</inf> concentration. The processing parameters are investigated ranging from(More)
  • 1