Yuichi Hamamura

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SUl\l~IARY Repairing embedded memories (e-memories) on an advanced system-on-chip (SOC) product is a key technique used to improve product yield. However. increasing the die area of SOC products equipped with various types of e-memories on the die is an issue. A fuse scheme can be used to resolve this issue. However. several fuse schemes that have been(More)
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