Yuen-Hui Chee

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The design and implementation of a 1.9GHz radio frequency transmit beacon is presented. The beacon is completely selfcontained, and all necessary energy is scavenged through solar and vibrational energy sources. Custom RF integrated circuitry and energy scavenging devices are used to create a highly integrated and efficient beacon. The 1.9GHz direct(More)
This paper presents an ultra-low power, low voltage injection locked transmitter for wireless sensor networks. The transmitter utilizes Film Bulk Acoustic Resonator (FBAR) to obtain a stable 1.9 GHz carrier and achieves 32% efficiency while delivering 0 dBm from a 280 mV supply. With 50% on-off keying, it consumes 1.6 mW and supports a maximum data rate of(More)
In a dense ad-hoc wireless sensor network, the transmit power is comparable to the circuit power. Linear power amplifiers, which require lower drive power as compared to its switching counterparts, now become a viable candidate. This paper presents a class A/B low power amplifier suitable for ad-hoc wireless sensor network. The amplifier is implemented in(More)
The PicoCube is a 1 cm<sup>3</sup> sensor node using harvested energy as its source of power. Operating at an average of only 6uW for a tirepressure application, the PicoCube represents a modular and integrated approach to the design of nodes for wireless sensor networks. It combines advanced ultra-low power circuit techniques with system-level power(More)
The PicoCube is a 1cm sensor node using harvested energy as its source of power. Operating at an average of only 6uW for a tirepressure application, the PicoCube represents a modular and integrated approach to the design of nodes for wireless sensor networks. It combines advanced ultra-low power circuit techniques with system-level power management. A(More)
Summary form only given. The availability of wireless transceivers transmitting over ranges from few microns to less than half a meter opens the door for a wide range of exciting new applications, ranging from seamless system assembly, smart surfaces, healthcare monitoring and intelligent machinery and components. However, the implementation challenges in(More)
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