Yuanchen Hu

  • Citations Per Year
Learn More
h THREE-DIMENSIONAL INTEGRATED circuits (ICs) are an emerging technology that allows vertical integration of chips interconnected with throughsilicon vias (TSVs). This technology can reduce interconnect delay and power and enable new computer architectures through heterogeneous integration. However, 3-D integration has significant challenges that must be(More)
The calibration of a partial discharge measuring system is carried out to determine its scale factor. This operation is performed in the complete test circuit by injecting across the terminals of the device under test a known charge generated by a traceable calibrator. The paper presents the calibration of four different partial discharge measuring systems,(More)
The fast increase in functionalities of handheld microelectronics devices results in more heat dissipation from the surface. The maximum amount of heat that can be dissipated passively is becoming the bottleneck. In this paper, a biomimetic transpiration cooling technique (BMTC) that may overcome this passive cooling limit is researched. By using a(More)
  • 1