Yongchang Lee

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The effect of Ni impurity on the self-diffusivity of bSn in the (1 0 1) symmetric tilt grain boundary is investigated. Using molecular dynamics simulations over a temperature range of 300–450 K. It is shown that Ni solute decreases the grain boundary self-diffusivity of bSn as the amount of solute in grain boundary increases. We also study the solute effect(More)
Demand for long-term reliability of electronic packaging has lead to a large number of studies on viscoplastic behavior of solder alloys. Various creep models for solder alloys have been proposed. They range from purely empirical to mechanism based models where dislocation motion and diffusion processes are taken into account. In this study, most commonly(More)
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