Yogendra K. Joshi

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Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solution to dramatically reduce the operating temperature of 3D ICs. In addition, designers use a highly complex hierarchical power distribution network in conjunction with decoupling(More)
BACKGROUND Chronic hepatitis B is a disease of concern due to its life-threatening complications like cirrhosis, and hepatocellular carcinoma (HCC) in 20-40% of patients. There are about 400 million people affected worldwide with HBV, and over 300,000 die every year from HBV-related diseases. Oral antivirals like lamivudine, adefovir, entecavir, and(More)
This paper addresses the thermal dissipation of power amplifier (PA) chips, which is one of the biggest challenges in the development of ultra-miniaturized glass-based RF modules. Glass packages with 3D or double-side active and passive integration offer the best miniaturization and performance enhancement for RF modules because glass has ultra-low loss,(More)
It is now widely recognized that the three-dimensional (3D) system integration is a key enabling technology to achieve the performance needs of future microprocessor integrated circuits (ICs). To provide modular thermal management in 3D-stacked ICs, the interlayer microfluidic cooling scheme is adopted and analyzed in this study focusing on a single cooling(More)
A compact, two-stage R-404A / R-508b cascade refrigeration system designed for interface with a high-performance microprocessor is under development. Such a system, designed to remove 100 W at –70 °C, can avoid the high cost of deep cryogenic cooling. Because thermal interface design is critical in maintaining low chip temperatures, a compact, microchannel(More)
Without whom this would never have been possible iv ACKNOWLEDGEMENTS This project would not have been possible without the support of many people, first and foremost my parents. Also, many thanks to my adviser, Dr. Yogendra K. Joshi, who read my numerous revisions and helped make sense of the confusion. Moreover, thanks to my committee members, Dr. Aaron(More)
— In this paper, the thermal performance of glass interposer substrate with copper through-package vias (TPVs) is investigated both experimentally and numerically. Copper via arrays with different via pitches and diameters were fabricated in 114.3 mm × 114.3 mm × 100 µm glass panels using low-cost laser drilling, electroless plating, and electroplating for(More)