—Three dimensional (3D) integration attempts to keep Moore's Law effectively in the years to come. Through-silicon-vias (TSV) processes offer a step towards 3D integration. In this work, the aspects of inductors in the TSV technologies are studied. Various TSV inductor topologies are examined both theoretically and by means of numerical simulations. As… (More)
—A new lumped model fully compatible with SPICE-like simulators is proposed in this work. The model is scalable, technology independent and can unify predict both capacitive and inductive coupling effects. It is validated up to 60 GHz by means of two commercial EM simulators.