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Power dissipation has become a pressing issue of concern in the designs of most electronic system as fabrication processes enter even deeper submicron regions. More specifically, leakage power plays a dominant role in system power dissipation. An emerging circuit design style, the reconfigurable single-electron transistor (SET) array, has been proposed for(More)
The power dissipation has become a crucial issue for most electronic circuit and system designs nowadays when fabrication processes exploit even deeper submicron technology. In particular, leakage power is becoming a dominant source of power consumption. In recent years, the reconfigurable single-electron transistor (SET) array has been proposed as an(More)
As fabrication process exploits even deeper submicron technology, global interconnect delay is becoming one of the most critical performance obstacles in system-on-chip (SoC) designs nowadays. Recent years latency-insensitive system (LIS), which enables multicycle communication to tolerate variant interconnect delay without substantially modifying(More)
As compared to two-dimensional (2D) ICs, 3D integration is a breakthrough technology of growing importance that has the potential to offer significant performance and functional benefits. This emerging technology allows stacking multiple layers of dies and resolves the vertical connection issue by through-silicon vias (TSVs). However, though a TSV is(More)
Since utilizing compound functional units (e.g., multiplier-accumulate) designed with shorter delay and/or smaller area than cascaded basic functional units is a well-known technique in system design, this paper presents an ILP-based approach for performance-driven behavioral synthesis with compound functional units. The algorithm maximizes the performance(More)
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