Yee-Wen Yen

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Sn-9Zn lead-free solder reacted with the Au/Ni/SUS304 multi-layer substrate at 240, 255 and 270C for 1 to 5 hours is investigated in this study. Only the flat intermetallic compound (IMC) was observed at the interface and this was likely the Ni5Zn21 phase. After a long reaction time, the IMC thickness for each couple increased. The linear relationship(More)
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