Yasushi Yamada

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Three types of inexpensive Pb-free solder joints, namely Zn-based and Bi-based solders, and a CuSn alloy were studied for application to the high-temperature operation of wide band-gap power semiconductor devices using GaN or SiC. Zn– Al solder sheets, whose melting point is 380°C were prepared, and then surface oxides were removed by RF plasma etching.(More)
A power semiconductor module using a bonding film with anisotropic thermal conduction has been studied. The bonding film consists of polyamide with a low Young's modulus and Z-axis-oriented fine graphite fibers. All the materials of this device, including the insulated substrate and base plate, have low coefficients of thermal expansion. The bonding film is(More)
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