Yassine Belmehdi

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Silicon dice soldered in power assemblies have to withstand simultaneously electrical, thermal and mechanical stress. Mechanical stress is an important issue because it will directly impact on both the device behaviour and power modules reliability. This paper focuses on the electro-mechanical static characterization of a planar gate IGBT by the help of(More)
Mechanical stress applied to the power devices can influence their static and dynamic electrical behaviors. The electrical characterization under mechanical stress might be exploited to monitor the mechanical state of the power assembly and then provide useful information regarding the health monitoring. In this study, we propose to evaluate the effect of(More)
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