Yao-Joe Yang

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This paper presents a novel method to fabricate temperature sensor arrays by dispensing a graphite-polydimethylsiloxane composite on flexible polyimide films. The fabricated temperature sensor array has 64 sensing cells in a 4×4 cm2 area. The sensor array can be used as humanoid artificial skin for sensation system of robots. Interdigitated copper(More)
This study involved fabricating barbed microtip-based electrode arrays by using silicon wet etching. KOH anisotropic wet etching was employed to form a standard pyramidal microtip array and HF/HNO3 isotropic etching was used to fabricate barbs on these microtips. To improve the electrical conductance between the tip array on the front side of the wafer and(More)
In this work, we present the development of a polymer-based capacitive sensing array. The proposed device is capable of measuring normal and shear forces, and can be easily realized by using micromachining techniques and flexible printed circuit board (FPCB) technologies. The sensing array consists of a polydimethlysiloxane (PDMS) structure and a FPCB. Each(More)
We propose an electrostatically-actuated microelectromechanical digital-to-analog converter (M-DAC) device with low actuation voltage. The spring structures of the silicon-based M-DAC device were monolithically fabricated using parylene-C. Because the Young's modulus of parylene-C is considerably lower than that of silicon, the electrostatic microactuators(More)
A micro-controller unit (MCU) assisted immunoassay lab-on-a-chip is realized in 0.35 μm CMOS technology. The MCU automatically controls the detection procedure including blood filtration through a nonporous aluminum oxide membrane, bimolecular conjugation with antibodies attached to magnetic beads, electrolytic pumping, magnetic flushing and threshold(More)
An implantable system-on-a-chip (SoC) integrating controller/actuation circuitry and 8 individually addressable drug reservoirs is proposed for on-demand drug delivery. It is implemented by standard 0.35-<i>&mu;</i>m CMOS technology and post-IC processing. The post-IC processing includes deposition of metallic membranes (200&#197; Pt/3000&#197; Ti/200&#197;(More)