Yao Hsu

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To study the quantitative reliability of electronic packages, a finite element analysis with the assumption that certain geometric parameters are random variables is carried out for a flip–chip package. The equivalent plastic strain range of the package subject to thermal–cyclic loading is obtained, and the fatigue life of the package is determined based on(More)
Power conservation is a very important aspect of modern-day technology. With its long life and low energy consumption, the high power light emitting diode (HP LED) has become very popular for lighting purposes. The die attachment layer is an important component of an HP LED package that is susceptible to thermal fatigue failure and therefore affects the(More)
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