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Article history: Received 30 August 2013 Received in revised form 2 December 2013 Accepted 2 December 2013 Available online 3 January 2014 Load-controlled fatigue and dwell-fatigue tests were conducted at elevated temperature to describe the high temperature mechanics behavior of nano-silver sintered lap-shear joints. The results showed that the shear(More)
Low-temperature silver sintering technology, which has been proven to be a promising die-attach solution, was extended to bonding large substrates. Strong bonding strengths for substrates greater than 25 mm × 50 mm were achieved by sintering a nanosilver paste at temperatures below 270°C with less than 5 MPa pressure. To characterize thermal(More)
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