Yang Shaohua

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We report here the lifetime testing of 10 high power cm-bar arrays using an automated diode array reliability experiment. The devices are tested at 25&#x00B0;C/100A, with a pulse width of 200&#x00B5;s and a duty factor of 2%. Most devices survive more than 1.0&#x00D7;10<sup>9</sup> shots. Failure analysis results on the few failing devices reveal failure(More)
A method based on magneto-acoustic technique is developed to measure bioelectric currents non-invasively. Theoretically, vibrations of particles in the medium are produced due to the Lorentz force when oscillatory currents flow through medium in a steady magnetic field. These vibrations contain information of the bioelectric currents and can be detected by(More)
In this study, the formation mechanisms of Kirkendall voids in Sn3Ag0.5Cu/Cu and Ni/Sn3Ag0.5Cu/Cu joints were investigation, and the coupling effect of joint size and Kirkendall voids on the fracture features of Ni/SnAgCu/Cu joints were also studied. It was found that the size effect had a significant influence on the formation of Kirkendall voids at Cu(More)
A high resolution and high sensitivity camera was developed using back illuminated, frame transfer on-chip electron multiplying gain CCD(EMCCD) with 1024&#x00D7;1024 pixels named CCD201 from E2V technologies. The CCD timing generated by a CPLD affords the normal EMCCD diver timing via a vertical clock driver chip EL7156. A programmable control voltage power(More)
Great advances in microelectronics failure physics, process reliability, reliability test and evaluation and failure analysis technologies have been achieved in China recently. Some of the significant achievements include the Hot-Carrier Injection (HCI) degradation model, gate oxide TDDB, Negative Bias Temperature Instability (NBTI) of very deep(More)
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