We don’t have enough information about this author to calculate their statistics. If you think this is an error let us know.
Learn More
Through-silicon vias (TSVs) play an important role as the vertical connections in three dimensional (3D) integrated circuit (IC). However, the 3D IC suffers from the increasing crosstalk noise between TSVs as the working frequency gets higher. The crosstalk in TSV arrays is more complicated than that of 2D IC because more aggressors have to be considered.(More)
In the VLSI, the crosstalk is a crucial problem for the circuit performance improvement. Both the crosstalk avoidance code (CAC) and shielding wire technique can effectively eliminate the crosstalk noise. But the CAC consumes too much codec area and codec power with the increase of the bus width, and the shielding wire technique costs too much system(More)
  • 1