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Up to now, most of people are still cooking in the kitchen, which makes them feel fatigued and also makes air polluted. With the development of the numerical control technology, it becomes more and more urgent to apply the related technology to the automatic cooking field. In this paper, the cooking techniques for the Chinese dishes is introduced and an(More)
With continuous scaling of Complementary Metal Oxide Semicondutor (CMOS) device dimensions, traditional inter-level dielectrics have be replaced by low-k materials, because of the advantages of ultra low-k material such as lower parasitic capacitance, lower cross talk effects, and lower RC delay. The new material in integrated circuits (IC) makes physical(More)
Reliability tests, such as High-Temperature Operating Life (HTOL), Hot Carrier Injection (HCI), Time Dependent Dielectric Breakdown (TDDB), etc., is required for the lifetime prediction of an integrated circuit (IC) product. Transmission Electron Microscopy (TEM) analysis is required to provide insights to the defect mechanisms, induced in the scaled gate(More)