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Prostaglandin endoperoxide synthase (PGHS) catalyses the rate-limiting step in the formation of prostaglandin and thromboxane eicosanoids from arachidonic acid released by phospholipase A(2). Two forms of PGHS exist, PGHS-1 and PGHS-2. PGHS-2, normally absent from cells, is rapidly expressed in response to a wide variety of stimuli and has been implicated(More)
A modified Euclidean decoding algorithm to solve the Berlekamp s key equation of Reed–Solomon code for correcting errors, is presented in this paper. It is derived to solve the error locator and evaluator polynomials simultaneously without performing the operations of polynomial division and field element inversion. In this algorithm, the number of(More)
Cyclooxygenase-2 (Cox-2), an enzyme responsible for catalyzing the committed step in prostanoid biosynthesis, is the product of an immediate early gene capable of being up-regulated by diverse stimuli. Significantly Cox-2 mRNA is absent from rat pheochromocytoma (PC12) cells, both basally and following stimulation with a range of agonists. Using PC12 cells(More)
Cyclooxygenase 2 (COX-2) inhibits nerve growth factor (NGF) withdrawal apoptosis in differentiated PC12 cells. The inhibition of apoptosis by COX-2 was concomitant with prevention of caspase 3 activation. To understand how COX-2 prevents apoptosis, we used cDNA expression arrays to determine whether COX-2 regulates differential expression of(More)
Articles you may be interested in Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints Effect of void propagation on bump resistance due to electromigration in flip-chip solder joints using Kelvin structure Appl. Investigation of void nucleation and propagation during(More)
To keep up with the demand of continuous increase in device densities, the integration of three-dimensional integrated circuits (3D-IC) has become the most probable solution, and the utilization of ultra-finepitch microbump has emerged as an essential component of 3D-IC technology. In this study, a Kelvin bump structure was fabricated and resistances(More)