Y. Sinquin

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This paper is dedicated to the full integration of innovative silicon-based material for Wafer-Level molding of silicon interposer wafers. This technology can be used in the frame of silicon packages where the silicon interposer is either reported on P-BGA or directly assembled on board. Interest of such material, is the rapid Wafer-Level lamination process(More)
Planar patch-clamp is a two-dimensional variation of traditional patch-clamp. By contrast to classical glass micropipette, the seal quality of silicon patch-clamp chips (i.e. seal resistance and seal success rate) have remained poor due to the planar geometry and the nature of the substrate and thus partially obliterate the advantages related to planar(More)
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