Y. H. Hsien

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This study evaluates Cu emissions in air-particulate and gas phases during thermal treatment of simulated copper sludge by a rotary kiln. Influences of operating parameters, including treatment temperature (400-700 degrees C), rotary speed (0.89-2.00 rpm) and copper content in sludge (1% to 5% by weight) on copper emissions were investigated. The toxicity(More)
The fundamental film properties and microstructures of the different aluminum (Al) metal layers are evaluated to fabricate a replacement metal gate (RMG) device for the high-k metal gate (HKMG) application at 28nm node. A PVD Al fill-in metal deposition process, called one step hot Al (HAL), was found the resistivity increases with increasing the thickness(More)
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