Y. Avenas

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—The paper focuses on a new generation of power modules, trying to optimize the tradeoff between thermal and EMI managements. At the same time, the packaging approach is considered in order to simplify the implementation of the power dies while improving the reliability of the structure. The approach considers the hybrid integration of the power dies, one(More)
Due to new applicative domains like embedded systems, power electronic converters are getting more and more compact, increasing their power densities and working in extreme environments with higher lifetime requirements in accordance with design to cost optimization. Power components packaging is thus involved in many research considerations such as thermal(More)
—This study deals with the power electronics packaging and the needs for additional knowledge about electrical pressed contact behavior. For this, a measure bench has been realized. It is able to characterize the pressed interface between a metal electrode and a power chip as a function of the clamping force (0-8000N) and the temperature (up to 100°C).(More)
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