Xue Heping

We don’t have enough information about this author to calculate their statistics. If you think this is an error let us know.
Learn More
3-D finite element models of SOP (Small Outline Package) were constructed, in which Anand visco-plasticity constitutive equation was used to describe the mechanic behavior of solder joint. The solder joint deformation and stress distribution with five kinds of lead shapes were researched. The experimental program for the identification of numeri3cal(More)
  • 1