Xinzhong Duo

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In order to enhance robustness of RF circuits, a flow of statistical analysis for chip-package co-design of RF system-on-package (SoP) is presented in this work. Methods for improving the yield of RF modules are developed. On-chip passive components versus off-chip passive components trade-offs in SoP module were also analyzed in terms of performance and(More)
Advances of VLSI and packaging technologies enable condensed integration of system level functions in a single module, known as SoC and SoP. In order to find a better solution between SoC and SoP, and eliminate constraints between chip and package, a complete solution is needed to co-design and co-optimize chip and package in a total design plan with(More)
H was implanted into single-crystal silicon with a dose of 1310/cm and an energy of 30 KeV, and then He was implanted into the same sample with the same dose and an energy of 33 KeV. Both of the implantations were performed at room temperature. Subsequently, the samples were annealed in a temperature range from 200 to 450 °C for 1 h. Cross-sectional(More)
The transceivers for future technology (third generation cellular, wireless LAN) need to be portable (compact), battery-powered and wireless. The present single-chip solutions for RF front-ends do not yield complete system integration. A system-on-a-package (SoP) approach can solve these problems. High quality components can be integrated in the package.(More)
Abstract Advances of VLSI and packaging technologies enable condensed integration of an RF system in a single module, known as SoC and SoP. In order to find a better solution between SoC and SoP for RF systems and their sub-systems, it is needed to predict and estimate performance of each solution. In this paper, analytical equations for noise figure and(More)
The transceivers for future technology (third generation cellular, wireless LAN) need to be portable (compact), battery-powered and wireless. The present single-chip solutions for RF front-ends do not yield complete system integration. A system-on-a-package (SoP) approach can solve these problems. High quality components can be integrated in the package.(More)
In this document, we have shown the advantages of SoP using MCM-D technology as a solution for producing integrated parts for use in RF systems offers many significant advantages over more traditional technologies. In particular the size reductions and performance improvements possible allow product developers to meet more closely the requirements of the(More)
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