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Bond pad sidewall polymer removal in a thick passivation device was attempted using different approaches, longer NE111 clean, 250°C bake and high temperature (HT) NE111 clean. SLAT methodology was adopted to evaluate the Al bond pad quality due to F-content on the bond pad surfaces during long term wafer storage. Both for 250°C bake and(More)
This paper describes a wafer-level Reliability test methodology for Al bond pad corrosion due to long term wafer storage even in a controlled environment, such as N2 cabinet or vacuum packaged wafer box. The sensitivity of such a reliability test very much depends on how well it captures fluorine contaminant and moisture, the two key determinants of Al pad(More)
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