Xingtian Shuai

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3D integrated circuits (3DICs) by stacking electronic devices can increase system functionality while decreasing the overall footprint. Through silicon via (TSV) technology based on thin wafers (typically below 100 μm) has been developed to realize 3DIC stacking over the last decades. Due to their fragileness and tendency of warping, thin device(More)
Flexible pressure sensors have attracted increasing research interest because of their potential applications for wearable sensing devices. Herein, a highly sensitive flexible pressure sensor is exhibited based on the elastomeric electrodes and a microarray architecture. Polydimethylsiloxane (PDMS) substrate, coated with silver nanowires (AgNWs), is used as(More)
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